2023中国电力电子与能量转换大会暨中国电源学会第二十六届学术年会及展览会

Harufusa Kondo 高级技术顾问
三菱电机功率器件制作所
报告题目：Advancement of Power chip and module technology

报告摘要：Mitsubishi Electric Corp. has long experience of innovative power devices. This speech will cover latest advancement of our power chips including Si-IGBT and SiC MOSFET. It also describes power modules for such applications like renewables, railway/power, white goods, and automotive.

报告人简介：Dr. Kondo received the B.S., M.S., and Ph.D. degrees from Osaka University, JAPAN.
In 1985, he joined Mitsubishi Electric Corporation. In her LSI R&D Laboratory, he had been engaged in the design of large-scale chips for digital communication.
In 2003, he moved to the Optical and High-frequency Device Works, where he had been worked on high-speed Optical Transceiver development.
Since 2009, he has been working at Power Device Works for the development of DIPIPM™, Industrial modules, and high-voltage modules including silicon IGBT and SiC MOSFET.
He is currently the Senior Technical Advisor at Power Device Works, Mitsubishi Electric Corporation.

重要日期

论文初稿提交截止时间

( ~~2023年6月30日~~ 2023年7月22日 )
工业报告征集截止时间

( ~~2023年7月15日~~ 2023年7月30日 )
专题讲座征集截时间

( ~~2023年7月15日~~ 2023年7月30日 )
论文录用通知时间

( 2023年8月15日 )
论文终稿提交时间

( 2023年9月15日 )
报名系统开放时间

( 2023年8月16日 )
大会时间

( 2023年11月10-13日 )